Springer Series in Reliability Engineering

Gan, Chong Leong; Huang, Chen Yu

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).

The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.

Details

Published by: Springer

Publication Date: 2025-07-22

Format: Hardcover

ISBN-13: 9783031947940

DOI: 10.1007/978-3-031-94795-7

Dimensions: 235cm x155cm

Pages: 178