Payment Systems Engineering An Engineer’s Guide to Cards, ACH, Wires, Instant Payment, and the Architecture Behind Modern Rails

Sale price  $58.49 Regular price  $64.99

Reliable shipping

Flexible returns

Payment Systems Engineering

An Engineer’s Guide to Cards, ACH, Wires, Instant Payment, and the Architecture Behind Modern Rails

Varun Pandey | Vaibhav Rastogi

Computers / Security / General

This book is a production-oriented engineering book that explains how modern payment systems are designed, built, and operated. It covers every major rail that moves money — cards, ACH, wires, instant payments, and cross-border networks — and treats each not as a business abstraction but as a technical system with specific behaviors, failure modes, and correctness requirements that engineers must understand to build on top of them reliably. 

Currently, there exists is a clear gap in the engineering literature here. Business overviews of payments exist in abundance, aimed at executives, product managers, and compliance professionals. Standards documentation exists for implementers of individual rails. What does not exist is a coherent, practitioner-written guide to how payment systems behave in production: how money flows through clearing and settlement, how failures propagate and must be handled, how ledgers are kept correct across distributed systems under partial failure, and how fraud detection, reconciliation, and operational controls are engineered as first-class architectural concerns rather than operational afterthoughts. This book fills that gap. 

 Throughout, the approach is toThis book explains not just what payment systems do but why they are designed that way — and what these design implications are for engineers who build on top of them. The book is not tied to any specific technology stack. Its value is in the reasoning and principles that transfer across languages, frameworks, and institutions. 

 What You Will Learn 

How each major payment rail — cards, ACH, wires, RTP/FedNow, and cross-border networks — functions at the clearing and settlement layer, including timing windows, finality rules, and the specific conditions under which transactions return, reverse, or fail. 

 • How to design payment ledgers and transaction records that remain correct and auditable under the partial failures, retries, duplicate submissions, and race conditions that distributed payment environments routinely produce. 

 • How to engineer fraud and risk controls, exception-handling workflows, and reconciliation pipelines as core architectural components — not operational overlays added after the fact. 

 • How to apply a payment-specific engineering mindset to system design, encompassing regulatory constraints, counterparty trust boundaries, settlement risk, and the auditability requirements that distinguish payment platforms from general-purpose distributed systems. 

• How to evaluate and work with emerging capabilities — payment orchestration, open banking APIs, and AI-assisted payment operations — with a grounded understanding of the infrastructure those capabilities depend on. 

 Who This Book is For 

 The primary audience is mid-to-senior software engineers, solution architects, and technical leads who are building or operating payment systems at financial institutions, fintech companies, or technology companies expanding into financial services. Readers are assumed to have a solid engineering foundation; the book teaches payment domain depth, not general programming. A secondary audience includes engineering managers and technical product leaders who need enough domain fluency to make sound architecture and investment decisions, and advanced students in computer science, financial engineering, or applied mathematics who are entering financial technology roles. 

Varun Pandey is a Vice President and Senior Lead Software Engineer in Payment Technology at JPMorgan Chase, where he leads platform engineering for consumer payment rails, including Real-Time Payments (RTP) and Request for Payment (RFP). These products serve tens of millions of Chase customers. Over more than fourteen years, he has built and modernized payment infrastructure at JPMorgan Chase, Capital One, and Citi, and he holds patents issued by the United States Patent and Trademark Office in payment technology. His research on payment systems engineering is forthcoming in peer-reviewed journals from Taylor & Francis and Elsevier. 

His work sits where large-scale distributed systems meet the regulatory and operational constraints specific to financial infrastructure, and this book is built directly from that practice. The chapters address problems he has solved in production at institutional transaction volumes: ledger correctness, idempotency at scale, exception propagation, fraud control design, reconciliation pipelines. The aim is to extract the reasoning any engineer in this domain needs to build payment systems that are correct, auditable, and resilient. 

 

Vaibhav Rastogi is a senior technology and management executive with fifteen years of experience leading enterprise-scale payment and financial technology systems at major Fortune 500 companies. He has built and deployed large production platforms in payments, checkout, and subscription management, and is a named inventor on granted U.S. patents in payment technology, distributed computing, and financial security. His experience includes leadership roles at Block, Walmart, Capital One, and GEICO. At Block, he led secure card-on-file transfer technology that improved payment authorization rates by 200 basis points while sustaining 99.99% uptime. At Walmart, he developed a distributed POS architecture that processed 300% more transactions per minute, reduced more than $20 million in annual vendor costs, and scaled across 10,500+ stores in 19 countries. At Capital One, he led an AI/ML-driven subscription management platform serving 100+ million cardholders and 10,000+ merchants. At GEICO, he held senior technology leadership responsibilities across large-scale financial services infrastructure. 


Publication Date: 11 January 2027
Publisher: Apress
Imprint: Apress
ISBN-13: 9798868831614
Format: Paperback softback

You may also like