Thermal Reliability of Power Semiconductor Device in the Renewable Energy System

Du, Xiong; Zhang, Jun; Li, Gaoxian; Yu, Yaoyi; Qian, Cheng; Du, Rui

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 

Details

Published by: Springer

Publication Date: 2022-07-09

Format: Hardcover

ISBN-13: 9789811931314

DOI: 10.1007/978-981-19-3132-1

Dimensions: 235.0cm x155.0cm

Pages: 172.0