{"product_id":"9789811061646","title":"Springer Theses","description":"\u003ch1\u003eSpringer Theses\u003c\/h1\u003e \u003ch2\u003eCheng, Jie\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003eThis thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO\u003csub\u003e4\u003c\/sub\u003e-based slurry. The thesis subsequently studies Cu\/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2017-09-18\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9789811061646\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-981-10-6165-3\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 137\u003c\/p\u003e ","brand":"Springer Nature Singapore","offers":[{"title":"Default Title","offer_id":47668126023820,"sku":"9789811061646","price":98.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9789811061646.jpg?v=1776462703","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9789811061646","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}