{"product_id":"9783662488218","title":"Springer Theses","description":"\u003ch1\u003eSpringer Theses\u003c\/h1\u003e \u003ch2\u003eZhang, Qingke\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003eThis thesis\npresents a series of mechanical test methods and comprehensively investigates\nthe deformation and damage behavior of Cu\/Pb-free solder joints under different\nloading conditions. The fracture behavior of Pb-free joint interfaces induced\nby stress, deformation of solder and substrate are shown, the shear fracture\nstrength of the Cu6Sn5 IMC is measured experimentally for the first time, and\nthe dynamic damage process and microstructure evolution behavior of Pb-free\nsolder joints are revealed intuitively. The thesis puts forward the argument\nthat the local cumulative damage is the major cause of failure in solder\njoints. The research results provide the experimental and theoretical basis for\nimproving the reliability of solder joints.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2015-11-16\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9783662488218\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-3-662-48823-2\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 143\u003c\/p\u003e ","brand":"Springer Berlin Heidelberg","offers":[{"title":"Default Title","offer_id":45582712995980,"sku":"9783662488218","price":49.49,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9783662488218.jpg?v=1775768863","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9783662488218","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}