{"product_id":"9783642632211","title":"Springer Series in Advanced Microelectronics","description":"\u003ch1\u003eSpringer Series in Advanced Microelectronics\u003c\/h1\u003e \u003ch2\u003eHo, Paul S.; Leu, Jihperng; Lee, Wei William\u003c\/h2\u003e \u003cp\u003eLow dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for \u0026lt; 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2012-10-04\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003eISBN-13: 9783642632211\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-3-642-55908-2\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 310\u003c\/p\u003e ","brand":"Springer Berlin Heidelberg","offers":[{"title":"Default Title","offer_id":49471306399884,"sku":"9783642632211","price":152.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9783642632211.jpg?v=1777983216","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9783642632211","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}