{"product_id":"9783540210498","title":"Springer Series in Materials Science: Applications and Technology","description":"\u003ch1\u003eSpringer Series in Materials Science: Applications and Technology\u003c\/h1\u003e \u003ch2\u003eAlexe, Marin; Gösele, Ulrich\u003c\/h2\u003e \u003cp\u003eDuring the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2004-05-14\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9783540210498\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-3-662-10827-7\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 504\u003c\/p\u003e ","brand":"Springer Berlin Heidelberg","offers":[{"title":"Default Title","offer_id":49937229971596,"sku":"9783540210498","price":341.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9783540210498.jpg?v=1779040522","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9783540210498","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}