Springer Series in Materials Science: Applications and Technology

Alexe, Marin; Gösele, Ulrich

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Details

Published by: Springer

Publication Date: 2004-05-14

Format: Hardcover

ISBN-13: 9783540210498

DOI: 10.1007/978-3-662-10827-7

Dimensions: 235cm x155cm

Pages: 504