{"product_id":"9783319854618","title":"Testing of Interposer-Based 2.5D Integrated Circuits","description":"\u003ch1\u003eTesting of Interposer-Based 2.5D Integrated Circuits\u003c\/h1\u003e \u003ch2\u003eWang, Ran; Chakrabarty, Krishnendu\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003eThis book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits.  The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.  This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2018-05-09\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003eISBN-13: 9783319854618\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-3-319-54714-5\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 182\u003c\/p\u003e ","brand":"Springer International Publishing","offers":[{"title":"Default Title","offer_id":47697625415820,"sku":"9783319854618","price":107.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9783319854618_8c061a33-9669-4d0a-88b5-7ea4665c832f.jpg?v=1776778731","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9783319854618","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}