{"product_id":"9783319792552","title":"Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications","description":"\u003ch1\u003eThree-Dimensional Integration of Semiconductors: Processing, Materials, and Applications\u003c\/h1\u003e \u003ch2\u003eKondo, Kazuo; Kada, Morihiro; Takahashi, Kenji\u003c\/h2\u003e \u003cp\u003eThis book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2019-03-28\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003eISBN-13: 9783319792552\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-3-319-18675-7\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 408\u003c\/p\u003e ","brand":"Springer International Publishing","offers":[{"title":"Default Title","offer_id":47697837654156,"sku":"9783319792552","price":152.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9783319792552_1943cfba-c7d0-40f6-95ba-594d7198d221.jpg?v=1776779079","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9783319792552","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}