Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications

Kondo, Kazuo; Kada, Morihiro; Takahashi, Kenji

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Details

Published by: Springer

Publication Date: 2019-03-28

Format: Paperback

ISBN-13: 9783319792552

DOI: 10.1007/978-3-319-18675-7

Dimensions: 235cm x155cm

Pages: 408