{"product_id":"9783319374970","title":"Analog Circuits and Signal Processing","description":"\u003ch1\u003eAnalog Circuits and Signal Processing\u003c\/h1\u003e \u003ch2\u003eSalah, Khaled; Ismail, Yehea; El-Rouby, Alaa\u003c\/h2\u003e \u003cp\u003eThis book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2016-08-23\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003eISBN-13: 9783319374970\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-3-319-07611-9\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 179\u003c\/p\u003e ","brand":"Springer International Publishing","offers":[{"title":"Default Title","offer_id":45580206735500,"sku":"9783319374970","price":98.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9783319374970.jpg?v=1775747285","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9783319374970","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}