{"product_id":"9783319204802","title":"3D Stacked Chips: From Emerging Processes to Heterogeneous Systems","description":"\u003ch1\u003e3D Stacked Chips: From Emerging Processes to Heterogeneous Systems\u003c\/h1\u003e \u003ch2\u003eElfadel, Ibrahim (Abe) M.; Fettweis, Gerhard\u003c\/h2\u003e \u003cp\u003eThis book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2016-05-23\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9783319204802\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-3-319-20481-9\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 339\u003c\/p\u003e ","brand":"Springer International Publishing","offers":[{"title":"Default Title","offer_id":44807652966540,"sku":"9783319204802","price":49.49,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9783319204802.jpg?v=1775844041","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9783319204802","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}