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Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 7 of the Proceedings of the 2020 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of sseven from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:
Test Design and Inverse Method Algorithms
Inverse Problems: Virtual Fields Method
Residual Stresses: Measurement, Uncertainty & Validation
Residual Stresses: Eigenvalues, Modeling, & Crack Growth
Material Characterizations Using Thermography
Fatigue, Damage & Fracture Evaluation Using Infrared ThermographyPublished by: Springer
Publication Date: 2021-03-05
Format: Hardcover
ISBN-13: 9783030598631
DOI: 10.1007/978-3-030-59864-8
Dimensions: 279.0cm x210.0cm
Pages: 104.0