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This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models.
Published by: Springer
Publication Date: 2020-08-14
Format: Paperback
ISBN-13: 9783030200534
DOI: 10.1007/978-3-030-20051-0
Dimensions: 235cm x155cm
Pages: 208