{"product_id":"9783030089764","title":"Analog Circuits and Signal Processing: Minority and Majority Carriers Propagation in Semiconductor Substrate","description":"\u003ch1\u003eAnalog Circuits and Signal Processing: Minority and Majority Carriers Propagation in Semiconductor Substrate\u003c\/h1\u003e \u003ch2\u003eBuccella, Pietro; Stefanucci, Camillo; Kayal, Maher; Sallese, Jean-Michel\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003eThis book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools.\u003c\/p\u003e\u003cp\u003eThe injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits.\u003c\/p\u003e\u003cp\u003eThe injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis.\u003c\/p\u003e\u003cp\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eDiscusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits;\u003cbr\u003e\n\u003c\/li\u003e\n\u003cli\u003eIncludes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate;\u003cbr\u003e\n\u003c\/li\u003e\n\u003cli\u003eUses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices;\u003cbr\u003e\n\u003c\/li\u003e\n\u003cli\u003eOffers design guidelines to reduce couplings by adding specific protections.\u003c\/li\u003e\n\u003c\/ul\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2019-02-11\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003eISBN-13: 9783030089764\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-3-319-74382-0\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 183\u003c\/p\u003e ","brand":"Springer International Publishing","offers":[{"title":"Default Title","offer_id":45580208799884,"sku":"9783030089764","price":98.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9783030089764.jpg?v=1776452313","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9783030089764","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}