{"product_id":"9781489978011","title":"Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability","description":"\u003ch1\u003eFundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability\u003c\/h1\u003e \u003ch2\u003eLee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un; Ma, Hongtao\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003eThis unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2016-10-01\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003eISBN-13: 9781489978011\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-1-4614-9266-5\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 253\u003c\/p\u003e ","brand":"Springer US","offers":[{"title":"Default Title","offer_id":47517710712972,"sku":"9781489978011","price":98.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781489978011.jpg?v=1775966333","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9781489978011","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}