Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

Walker, Gerald A.

Details

Published by: Springer

Publication Date: 1962-01-01

Format: Paperback

ISBN-13: 9781489972972

DOI: 10.1007/978-1-4899-7311-5

Dimensions: 254.0cm x178.0cm

Pages: 328.0