Join our mailing list
Get exclusive deals and learn about new products!
Reliable shipping
Flexible returns
Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
Published by: Springer
Publication Date: 2013-06-20
Format: Paperback
ISBN-10: 9781489918062
ISBN-13: 9781489918062
DOI: 10.1007/978-1-4899-1804-8
Dimensions: 235cm x155cm
Pages: 358