{"product_id":"9781461372318","title":"The Springer International Series in Engineering and Computer Science: Tools and Techniques","description":"\u003ch1\u003eThe Springer International Series in Engineering and Computer Science: Tools and Techniques\u003c\/h1\u003e \u003ch2\u003eWagner, Lawrence C.\u003c\/h2\u003e \u003cp\u003e\u003cem\u003eFailure Analysis of Integrated Circuits: Tools and  Techniques\u003c\/em\u003e provides a basic understanding of how the most commonly  used tools and techniques in silicon-based semiconductors are applied  to understanding the root cause of electrical failures in integrated  circuits. These include applications specific to performing failure  analysis such as decapsulation, deprocessing, and fail site isolation,  as well as physical and chemical analysis tools and techniques. The  coverage is qualitative, and it provides a general understanding for  making intelligent tool choices. Also included is coverage of the  shortcomings, limitations, and strengths of each technique. \u003cbr\u003e  \u003cem\u003eFailure Analysis of Integrated Circuits: Tools and Techniques\u003c\/em\u003e is  a `must have' reference work for semiconductor professionals and  researchers.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2012-11-09\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003eISBN-13: 9781461372318\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-1-4615-4919-2\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 255\u003c\/p\u003e ","brand":"Springer US","offers":[{"title":"Default Title","offer_id":44358972833932,"sku":"9781461372318","price":152.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781461372318.jpg?v=1775009761","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9781461372318","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}