{"product_id":"9781461349778","title":"Foldable Flex and Thinned Silicon Multichip Packaging Technology","description":"\u003ch1\u003eFoldable Flex and Thinned Silicon Multichip Packaging Technology\u003c\/h1\u003e \u003ch2\u003eBalde, John W.\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eFoldable Flex and Thinned Silicon Multichip Packaging Technology\u003c\/strong\u003e presents newly emerging methods used to make stacked chip packages in the so-called 2-1\/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. \u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2014-02-23\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003e ISBN-10: 9781461349778\u003c\/p\u003e \u003cp\u003eISBN-13: 9781461349778\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-1-4615-0231-9\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 347\u003c\/p\u003e ","brand":"Springer","offers":[{"title":"Default Title","offer_id":44341270806668,"sku":"9781461349778","price":153.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781461349778.jpg?v=1755041589","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9781461349778","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}