Foldable Flex and Thinned Silicon Multichip Packaging Technology

Balde, John W.

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Details

Published by: Springer

Publication Date: 2014-02-23

Format: Paperback

ISBN-10: 9781461349778

ISBN-13: 9781461349778

DOI: 10.1007/978-1-4615-0231-9

Dimensions: 235cm x155cm

Pages: 347