{"product_id":"9781441951373","title":"Conceptual Design of Multichip Modules and Systems","description":"\u003ch1\u003eConceptual Design of Multichip Modules and Systems\u003c\/h1\u003e \u003ch2\u003eSandborn, Peter A.; Moreno, Hector\u003c\/h2\u003e \u003cp\u003e\u003cem\u003eConceptual Design of Multichip Modules and Systems\u003c\/em\u003e  treats activities which take place at the conceptual and specification  level of the design of complex multichip systems. These activities  include the formalization of design knowledge (information modeling),  tradeoff analysis, partitioning, and decision process capture. All of  these functions occur prior to the traditional CAD activities of  synthesis and physical design.\u003cbr\u003e  Inherent in the design of electronic modules are tradeoffs which must  be understood before feasible technology, material, process, and  partitioning choices can be selected. The lack of a complete set of  technology information is an especially serious problem in the  packaging and interconnect field since the number of technologies,  process, and materials is substantial and selecting optimums is  arduous and non-trivial if one truly wants a balance in cost and  performance. Numerous tradeoff and design decisions have to be made  intelligently and quickly at the beginning of the design cycle before  physical design work begins. These critical decisions, made within the  first 10% of the total design cycle, ultimately define up to 80% of  the final product cost.\u003cbr\u003e  \u003cem\u003eConceptual Design of Multichip Modules and Systems\u003c\/em\u003e lays the  groundwork for concurrent estimation level analysis including size,  routing, electrical performance, thermal performance, cost,  reliability, manufacturability, and testing. It will be useful both as  a reference for system designers and as a text for those wishing to  gain a perspective on the nature of packaging and interconnect design,  concurrent engineering, computer-aided design, and system synthesis.  \u003cbr\u003e\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2010-12-07\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003eISBN-13: 9781441951373\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-1-4757-4841-3\u003c\/p\u003e \u003cp\u003eDimensions: 279.0cm x210.0cm\u003c\/p\u003e \u003cp\u003ePages: 260.0\u003c\/p\u003e ","brand":"Springer US","offers":[{"title":"Default Title","offer_id":45578425237644,"sku":"9781441951373","price":152.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781441951373.jpg?v=1767146988","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9781441951373","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}