{"product_id":"9781441909831","title":"RF and Microwave Microelectronics Packaging","description":"\u003ch1\u003eRF and Microwave Microelectronics Packaging\u003c\/h1\u003e \u003ch2\u003eKuang, Ken; Kim, Franklin; Cahill, Sean S.\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003eRF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical\/RF\/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF\/MW packaging-related fields.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2009-11-17\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9781441909831\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-1-4419-0984-8\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 285\u003c\/p\u003e ","brand":"Springer US","offers":[{"title":"Default Title","offer_id":50148687839372,"sku":"9781441909831","price":152.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781441909831.jpg?v=1779567185","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9781441909831","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}