{"product_id":"9781402073304","title":"The Springer International Series in Engineering and Computer Science","description":"\u003ch1\u003eThe Springer International Series in Engineering and Computer Science\u003c\/h1\u003e \u003ch2\u003eMadenci, Erdogan; Guven, Ibrahim; Kilic, Bahattin\u003c\/h2\u003e \u003cp\u003e\u003cstrong\u003eFatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS®\u003c\/strong\u003e describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. \u003cbr\u003e\u003cstrong\u003eFatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS®\u003c\/strong\u003e allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2002-12-31\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9781402073304\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-1-4615-0255-5\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 185\u003c\/p\u003e ","brand":"Springer US","offers":[{"title":"Default Title","offer_id":45578422288524,"sku":"9781402073304","price":179.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781402073304.jpg?v=1775009580","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9781402073304","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}