The Springer International Series in Engineering and Computer Science

Madenci, Erdogan; Guven, Ibrahim; Kilic, Bahattin

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Details

Published by: Springer

Publication Date: 2002-12-31

Format: Hardcover

ISBN-13: 9781402073304

DOI: 10.1007/978-1-4615-0255-5

Dimensions: 235cm x155cm

Pages: 185