{"product_id":"9781394188796","title":"Polymeric Materials for Electronic Packaging","description":"\u003ch1\u003ePolymeric Materials for Electronic Packaging\u003c\/h1\u003e\u003ch3\u003eShozo Nakamura\u003c\/h3\u003e\u003cdiv\u003e\u003cb\u003eTechnology \u0026amp; Engineering \/ Materials Science \/ Electronic Materials\u003c\/b\u003e\u003c\/div\u003e\u003cbr\u003e\u003cdiv\u003e\n\u003cb\u003ePOLYMERIC MATERIALS FOR ELECTRONIC PACKAGING\u003c\/b\u003e \u003cp\u003e\u003cb\u003eCreate and deploy reliable polymeric materials for use in electronic products with this comprehensive guide\u003c\/b\u003e \u003c\/p\u003e\n\u003cp\u003eModern electronic products are manufactured at a finer scale and with more precision than ever before. This places increasing demand on the proper use and management of high-performance polymers to create reliable, rapidly-operating semiconductor products. Understanding the physical properties and viscoelasticity analysis of resins is essential for engineers and researchers to perfect and deploy these polymers in electronics contexts. \u003c\/p\u003e\n\u003cp\u003e\u003ci\u003ePolymeric Materials for Electronic Packaging \u003c\/i\u003eis designed to meet this specific need with a thorough introduction to these materials and their production. It provides the tools engineers need to reduce processing times and increase durability in their semiconductor packages and products. Translated from the Japanese original and offering in-depth analysis from a global-leading expert, this promises to be an indispensable volume. \u003c\/p\u003e\n\u003cp\u003e\u003ci\u003ePolymeric Materials for Electronic Packaging \u003c\/i\u003ereaders will also find: \u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eDetailed treatment of subjects including viscoelastic theory, design issues of LSI packages, and more\u003c\/li\u003e \u003cli\u003eAnalysis uniquely suited to the dimensions of cutting-edge semiconductor technology\u003c\/li\u003e \u003cli\u003eIncorporation of cutting-edge viscoelasticity analysis software, available separately from the author\u003c\/li\u003e\n\u003c\/ul\u003e \u003cp\u003e\u003ci\u003ePolymeric Materials for Electronic Packaging \u003c\/i\u003eis critical for electrical and electronics engineers working with semiconductors, as well as advanced postgraduate students and researchers in this or numerous related areas.\u003c\/p\u003e\n\u003c\/div\u003e\u003cdiv\u003e  \u003cp\u003e\u003cb\u003eShozo Nakamura, PhD, \u003c\/b\u003eis Professor Emeritus at the Hiroshima Institute of Technology, Japan, and a sought-after corporate technical adviser. In 2019, he established the Nakamura Technical Research Institute. \u003c\/p\u003e\n\u003c\/div\u003e\u003cbr\u003e\u003ctable\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublication Date: \u003c\/td\u003e\n\u003ctd\u003e20 September 2023\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublisher: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eImprint: \u003c\/td\u003e\n\u003ctd\u003eWiley-IEEE Press\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eISBN-13: \u003c\/td\u003e\n\u003ctd\u003e9781394188796\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFormat: \u003c\/td\u003e\n\u003ctd\u003eHardback\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePage Count: \u003c\/td\u003e\n\u003ctd\u003e208\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/table\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":44314733871244,"sku":"9781394188796","price":139.45,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781394188796_43f53bbd-9ae6-4d1e-888a-08fd3cca0c05.jpg?v=1780144278","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9781394188796","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}