{"product_id":"9780792378617","title":"Electrothermal Analysis of VLSI Systems","description":"\u003ch1\u003eElectrothermal Analysis of VLSI Systems\u003c\/h1\u003e \u003ch2\u003eYi-Kan Cheng; Ching-Han Tsai; Chin-Chi Teng; Sung-Mo (Steve) Kang\u003c\/h2\u003e \u003cp\u003e\u003cem\u003eElectrothermal Analysis of VLSI Systems\u003c\/em\u003e addresses  electrothermal problems in modern VLSI systems. \u003cbr\u003e  Part I, The Building Blocks, discusses electrothermal phenomena and  the fundamental building blocks that electrothermal simulation  requires (including power analysis, temperature-dependent device  modeling, thermal\/electrothermal simulation, and experimental  setup-calibration). \u003cbr\u003e  Part II, The Applications, discusses three important applications of  VLSI electrothermal analysis including temperature-dependent  electromigration diagnosis, cell-level thermal placement and  temperature-driven power and timing analysis. \u003cbr\u003e  \u003cem\u003eElectrothermal Analysis of VLSI Systems\u003c\/em\u003e will be useful for  researchers in the fields of IC reliability analysis and physical  design, as well as VLSI designers and graduate students.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2000-06-30\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9780792378617\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/b117332\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 210\u003c\/p\u003e ","brand":"Springer US","offers":[{"title":"Default Title","offer_id":47388813000844,"sku":"9780792378617","price":98.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9780792378617.jpg?v=1775759598","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9780792378617","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}