{"product_id":"9780471780465","title":"High-Speed VLSI Interconnections","description":"\u003ch3\u003eWiley Series in Microwave and Optical Engineering\u003c\/h3\u003e\u003ch1\u003eHigh-Speed VLSI Interconnections\u003c\/h1\u003e\u003ch3\u003eAshok K. Goel\u003c\/h3\u003e\u003cdiv\u003e\u003cb\u003eTechnology \u0026amp; Engineering \/ Electronics \/ Circuits \/ VLSI \u0026amp; ULSI\u003c\/b\u003e\u003c\/div\u003e\u003cbr\u003e\u003cdiv\u003eThis Second Edition focuses on emerging topics and advances in the field of VLSI interconnections\u003cbr\u003e \u003cbr\u003e In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.\u003cbr\u003e \u003cbr\u003e Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:\u003cbr\u003e *\u003cbr\u003e \u003cbr\u003e Preliminary Concepts\u003cbr\u003e *\u003cbr\u003e \u003cbr\u003e Parasitic Resistances, Capacitances, and Inductances\u003cbr\u003e *\u003cbr\u003e \u003cbr\u003e Interconnection Delays\u003cbr\u003e *\u003cbr\u003e \u003cbr\u003e Crosstalk Analysis\u003cbr\u003e *\u003cbr\u003e \u003cbr\u003e Electromigration-Induced Failure Analysis\u003cbr\u003e *\u003cbr\u003e \u003cbr\u003e Future Interconnections\u003cbr\u003e \u003cbr\u003e High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.\u003c\/div\u003e\u003cdiv\u003e \u003cp\u003eAShok k. Goel, PhD, is Associate Professor of Electrical Engineering at Michigan Technological University. He is the author of more than thirty journal publications and numerous conference proceedings. His research interests include nanotechnology circuit design, high-speed VLSI interconnections, device physics and modeling, and semiconductor TCAD.\u003c\/p\u003e \u003c\/div\u003e\u003cbr\u003e\u003ctable\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublication Date: \u003c\/td\u003e\n\u003ctd\u003e17 September 2007\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublisher: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eImprint: \u003c\/td\u003e\n\u003ctd\u003eWiley-IEEE Press\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eISBN-13: \u003c\/td\u003e\n\u003ctd\u003e9780471780465\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFormat: \u003c\/td\u003e\n\u003ctd\u003eHardback\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePage Count: \u003c\/td\u003e\n\u003ctd\u003e432\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight (oz): \u003c\/td\u003e\n\u003ctd\u003e25.92\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/table\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":44310854336652,"sku":"9780471780465","price":198.86,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9780471780465.jpg?v=1780182045","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9780471780465","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}