{"product_id":"9780471709602","title":"Advanced Integrated Communication Microsystems","description":"\u003ch3\u003eWiley Series in Microwave and Optical Engineering\u003c\/h3\u003e\u003ch1\u003eAdvanced Integrated Communication Microsystems\u003c\/h1\u003e\u003ch3\u003eJoy Laskar | Sudipto Chakraborty | Anh-Vu Pham | Manos M. Tantzeris\u003c\/h3\u003e\u003cdiv\u003e\u003cb\u003eTechnology \u0026amp; Engineering \/ Telecommunications\u003c\/b\u003e\u003c\/div\u003e\u003cbr\u003e\u003cdiv\u003eLearn the fundamentals of integrated communication microsystems  \u003cp\u003eAdvanced communication microsystems—the latest technology to emerge in the semiconductor sector after microprocessors—require integration of diverse signal processing blocks in a power-efficient and cost-effective manner. Typically, these systems include data acquisition, data processing, telemetry, and power management. The overall development is a synergy among system, circuit, and component-level designs with a strong emphasis on integration.\u003c\/p\u003e \u003cp\u003eThis book is targeted at students, researchers, and industry practitioners in the semiconductor area who require a thorough understanding of integrated communication microsystems from a developer's perspective. The book thoroughly and carefully explores:\u003c\/p\u003e \u003cul\u003e \u003cli\u003e \u003cp\u003eFundamental requirements of communication microsystems\u003c\/p\u003e \u003c\/li\u003e \u003cli\u003e \u003cp\u003eSystem design and considerations for wired and wireless communication microsystems\u003c\/p\u003e \u003c\/li\u003e \u003cli\u003e \u003cp\u003eAdvanced block-level design techniques for communication microsystems\u003c\/p\u003e \u003c\/li\u003e \u003cli\u003e \u003cp\u003eIntegration of communication systems in a hybrid environment\u003c\/p\u003e \u003c\/li\u003e \u003cli\u003e \u003cp\u003ePackaging considerations\u003c\/p\u003e \u003c\/li\u003e \u003cli\u003e \u003cp\u003ePower and form factor trade-offs in building integrated microsystems\u003c\/p\u003e \u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003eAdvanced Integrated Communication Microsystems is an ideal textbook for advanced undergraduate and graduate courses. It also serves as a valuable reference for researchers and practitioners in circuit design for telecommunications and related fields.\u003c\/p\u003e\n\u003c\/div\u003e\u003cdiv\u003e \u003cp\u003e\u003cb\u003eJoy Laskar\u003c\/b\u003e, PhD, holds the Schlumberger Chair in Microelectronics in the School of Electrical and Computer Engineering at Georgia Tech. He is also founder and Director of the Georgia Electronic Design Center, where he heads a research group that focuses on the integration of high-frequency mixed-signal electronics for next-generation wireless and wire line systems.\u003c\/p\u003e \u003cp\u003e\u003cb\u003eSudipto Chakraborty\u003c\/b\u003e, PhD, is a research staff member at Texas Instruments, where he is involved in architecting and designing advanced system-on-chip mixed signal systems using silicon-based technologies. He has authored or coauthored several technical articles, journals, and books, and has served on the technical program committee for various IEEE conferences and journals.\u003c\/p\u003e \u003cp\u003e\u003cb\u003eManos M. Tentzeris\u003c\/b\u003e, PhD, is an Associate Professor in the School of Electrical and Computer Engineering at Georgia Tech. He is also the Associate Director of the Georgia Electronic Design Center in the area of RFID\/Sensors and heads the ATHENA group, which focuses on 3D integration and packaging, multiband\/ultrawideband antennas and antenna arrays, wearable\/flexible inkjet-printed electronics, CNT\/graphene, and integrable power scavenging.\u003c\/p\u003e \u003cp\u003e\u003cb\u003eFranklin Bien\u003c\/b\u003e, PhD, is an Assistant Professor at Ulsan National Institute of Science and Technology (UNIST), Korea, home for Hyundai\/Kia Motor Company. He cofounded and leads the UNIST Electronic Design Center (UEDC) focusing on analog\/mixed-signal and RF ICs for wireless communications and ubiquitous connectivity for automotive information technology applications.\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAnh-Vu Pham\u003c\/b\u003e, PhD, is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published extensively and received the National Science Foundation CAREER Award in 2001 and the 2008 Outstanding Young Engineer Award from the IEEE Microwave Theory and Techniques Society. He cofounded RF Solutions and PlanarMag, Inc., and has been an active consultant for industry.\u003c\/p\u003e\n\u003c\/div\u003e\u003cbr\u003e\u003ctable\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublication Date: \u003c\/td\u003e\n\u003ctd\u003e03 March 2009\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublisher: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eImprint: \u003c\/td\u003e\n\u003ctd\u003eWiley-IEEE Press\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eISBN-13: \u003c\/td\u003e\n\u003ctd\u003e9780471709602\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFormat: \u003c\/td\u003e\n\u003ctd\u003eHardback\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePage Count: \u003c\/td\u003e\n\u003ctd\u003e496\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight (oz): \u003c\/td\u003e\n\u003ctd\u003e27.2\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/table\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":44378684915852,"sku":"9780471709602","price":155.66,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9780471709602.jpg?v=1780280257","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9780471709602","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}