{"product_id":"9780471574811","title":"SemiConductor Wafer Bonding Science and Technology","description":"\u003ch3\u003eThe ECS Series of Texts and Monographs\u003c\/h3\u003e\u003ch1\u003eSemiConductor Wafer Bonding\u003c\/h1\u003e\u003ch2\u003eScience and Technology\u003c\/h2\u003e\u003ch3\u003eQ.-Y. Tong | U. Gösele\u003c\/h3\u003e\u003cdiv\u003e\u003cb\u003eScience \/ Chemistry \/ Physical \u0026amp; Theoretical\u003c\/b\u003e\u003c\/div\u003e\u003cbr\u003e\u003cdiv\u003eBonding - eine Technik zum \"Verschweißen\" von Halbleiter-Wafers ohne \"Klebstoff\" - wird in der Mikroelektronik, Energieelektronik, Mikromechanik, Optoelektronik und anderen Bereichen verbreitet eingesetzt. Dieser Band sammelt und systematisiert die in der Literatur verstreuten Informationen zum Wafer-Bonding; es finden sich beispielsweise Kapitel zum Bonding bei Raumtemperatur, zur Wärmebehandlung, zum Bonding ungleicher Materialien und strukturierter Wafers. (01\/99)\u003c\/div\u003e\u003cdiv\u003e Q.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University's School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Triangle Institute. He was formerly a consultant at the Max-Planck-Institute of Microstructure Physics.\u003cbr\u003e \u003cbr\u003e U. GÖSELE, PhD, is Director at the Max-Planck-Institute of Microstructure Physics in Halle, Germany, and J.B. Duke Professor of Materials Science at Duke University's School of Engineering in Durham, North Carolina.\u003c\/div\u003e\u003cbr\u003e\u003ctable\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublication Date: \u003c\/td\u003e\n\u003ctd\u003e07 December 1998\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublisher: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eImprint: \u003c\/td\u003e\n\u003ctd\u003eWiley-Interscience\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eISBN-13: \u003c\/td\u003e\n\u003ctd\u003e9780471574811\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFormat: \u003c\/td\u003e\n\u003ctd\u003eHardback\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePage Count: \u003c\/td\u003e\n\u003ctd\u003e320\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight (oz): \u003c\/td\u003e\n\u003ctd\u003e18.24\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/table\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":44310604054668,"sku":"9780471574811","price":185.36,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9780471574811.jpg?v=1780166238","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9780471574811","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}