{"product_id":"9780471466093","title":"Advanced Electronic Packaging","description":"\u003ch3\u003eIEEE Press Series on Microelectronic Systems\u003c\/h3\u003e\u003ch1\u003eAdvanced Electronic Packaging\u003c\/h1\u003e\u003ch3\u003eRichard K. Ulrich | William D. Brown\u003c\/h3\u003e\u003cdiv\u003e\u003cb\u003eTechnology \u0026amp; Engineering \/ Electronics \/ Circuits \/ General\u003c\/b\u003e\u003c\/div\u003e\u003cbr\u003e\u003cdiv\u003eAs in the \u003ci\u003eFirst Edition\u003c\/i\u003e, each chapter in this new \u003ci\u003eSecond Edition\u003c\/i\u003e is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the \u003ci\u003eFirst Edition\u003c\/i\u003e, which became an industry standard and a popular graduate-level textbook, have been retained.\u003cbr\u003e \u003cbr\u003e An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.\u003c\/div\u003e\u003cdiv\u003e  \u003cb\u003eRichard K. Ulrich\u003c\/b\u003e is a professor of chemical engineering at the University of Arkansas. He is a book editor and columnist on embedded passive technology, a NEMI committee member, an associate editor of IEEE Transactions on Advanced Packaging, and past chairman of chairman of the Dielectric Science and Technology Division of the Electrochemical Society.  \u003cp\u003e\u003cb\u003eWILLIAM D. BROWN\u003c\/b\u003e, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.\u003c\/p\u003e\n\u003c\/div\u003e\u003cbr\u003e\u003ctable\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublication Date: \u003c\/td\u003e\n\u003ctd\u003e24 February 2006\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublisher: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eImprint: \u003c\/td\u003e\n\u003ctd\u003eWiley-IEEE Press\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eISBN-13: \u003c\/td\u003e\n\u003ctd\u003e9780471466093\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFormat: \u003c\/td\u003e\n\u003ctd\u003eHardback\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePage Count: \u003c\/td\u003e\n\u003ctd\u003e848\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight (oz): \u003c\/td\u003e\n\u003ctd\u003e54.82\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/table\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":44384150618252,"sku":"9780471466093","price":197.96,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9780471466093_f03a496b-80a2-4f73-87c5-958440776cbb.jpg?v=1780203739","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9780471466093","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}