{"product_id":"9780471446538","title":"Silicon Germanium Technology, Modeling, and Design","description":"\u003ch1\u003eSilicon Germanium\u003c\/h1\u003e\u003ch2\u003eTechnology, Modeling, and Design\u003c\/h2\u003e\u003ch3\u003eRaminderpal Singh | Modest M. Oprysko | David Harame\u003c\/h3\u003e\u003cdiv\u003e\u003cb\u003eTechnology \u0026amp; Engineering \/ Electronics \/ Circuits \/ General\u003c\/b\u003e\u003c\/div\u003e\u003cbr\u003e\u003cdiv\u003e\"An excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications.\"\u003cbr\u003e -Ron Wilson, EETimes\u003cbr\u003e \u003cbr\u003e \"SiGe technology has demonstrated the ability to provide excellent high-performance characteristics with very low noise, at high power gain, and with excellent linearity. This book is a comprehensive review of the technology and of the design methods that go with it.\"\u003cbr\u003e -Alberto Sangiovanni-Vincentelli\u003cbr\u003e Professor, University of California, Berkeley\u003cbr\u003e Cofounder, Chief Technology Officer, Member of Board \u003cbr\u003e Cadence Design Systems Inc.\u003cbr\u003e \u003cbr\u003e Filled with in-depth insights and expert advice, Silicon Germanium covers all the key aspects of this technology and its applications. Beginning with a brief introduction to and historical perspective of IBM's SiGe technology, this comprehensive guide quickly moves on to:\u003cbr\u003e * Detail many of IBM's SiGe technology development programs\u003cbr\u003e * Explore IBM's approach to device modeling and characterization-including predictive TCAD modeling\u003cbr\u003e * Discuss IBM's design automation and signal integrity knowledge and implementation methodologies\u003cbr\u003e * Illustrate design applications in a variety of IBM's SiGe technologies\u003cbr\u003e * Highlight details of highly integrated SiGe BiCMOS system-on-chip (SOC) design\u003cbr\u003e \u003cbr\u003e \u003cbr\u003e Written for RF\/analog and mixed-signal designers, CAD designers, semiconductor students, and foundry process engineers worldwide, Silicon Germanium provides detailed insight into the modeling and design automation requirements for leading-edge RF\/analog and mixed-signal products, and illustrates in-depth applications that can be implemented using IBM's advanced SiGe process technologies and design kits.\u003cbr\u003e \u003cbr\u003e \"This volume provides an excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications. But just as important is the window the text provides into the infrastructure-the process development, device modeling, and tool development.\"\u003cbr\u003e -Ron Wilson\u003cbr\u003e Silicon Engineering Editor, EETimes\u003cbr\u003e \u003cbr\u003e \"This book chronicles the development of SiGe in detail, provides an in-depth look at the modeling and design automation requirements for making advanced applications using SiGe possible, and illustrates such applications as implemented using IBM's process technologies and design methods.\"\u003cbr\u003e -John Kelly\u003cbr\u003e Senior Vice President and Group Executive, Technology Group, IBM\u003c\/div\u003e\u003cdiv\u003e  RAMINDERPAL SINGH, PhD, is a Senior Engineer at IBM’s RF\/AMS Design Kit Group where he leads various projects related to transmission line model development, substrate modeling, and RF\/mixed-signal design methodologies. Dr. Singh has authored numerous technical publications in the area of signal integrity, and is Director of VSIA, as well as a Senior Member of IEEE. \u003cbr\u003e DAVID L. HARAME, PhD, is Director of the RF\/Analog and Mixed Signal Process Development, Modeling, and Design Automation area at IBM. He is an IEEE Fellow, Executive Committee member of the Bipolar\/BiCMOS Circuits and Technology Meeting (BCTM), and member of the Compact Model Council. \u003cbr\u003e MODEST M. OPRYSKO, PhD, joined IBM in 1986 and has held numerous management positions directing technology and application development activities spanning the areas of fiber optics, wireless (infrared and radio frequency technology), packaging technology, and circuit design devoted to communications applications. Currently, he is the Senior Manager of Communication Link Architecture, Design and Test.\u003c\/div\u003e\u003cbr\u003e\u003ctable\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublication Date: \u003c\/td\u003e\n\u003ctd\u003e07 November 2003\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublisher: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eImprint: \u003c\/td\u003e\n\u003ctd\u003eWiley-IEEE Press\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eISBN-13: \u003c\/td\u003e\n\u003ctd\u003e9780471446538\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFormat: \u003c\/td\u003e\n\u003ctd\u003eHardback\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePage Count: \u003c\/td\u003e\n\u003ctd\u003e368\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight (oz): \u003c\/td\u003e\n\u003ctd\u003e22.66\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/table\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":44380573794444,"sku":"9780471446538","price":188.96,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9780471446538_b984547f-7bd3-469f-ab52-f4fd7269701d.jpg?v=1780200297","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9780471446538","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}