{"product_id":"9780470971826","title":"Lead-free Solders Materials Reliability for Electronics","description":"\u003ch3\u003eWiley Series in Materials for Electronic \u0026amp; Optoelectronic Applications\u003c\/h3\u003e\u003ch1\u003eLead-free Solders\u003c\/h1\u003e\u003ch2\u003eMaterials Reliability for Electronics\u003c\/h2\u003e\u003ch3\u003eK. Subramanian\u003c\/h3\u003e\u003cdiv\u003e\u003cb\u003eTechnology \u0026amp; Engineering \/ Materials Science \/ Metals \u0026amp; Alloys\u003c\/b\u003e\u003c\/div\u003e\u003cbr\u003e\u003cdiv\u003eProviding a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. \u003ci\u003eLead-free Solders: Materials Reliability for Electronics\u003c\/i\u003e chronicles the search for reliable drop-in lead-free alternatives and covers:  \u003cul\u003e \u003cli\u003ePhase diagrams and alloy development \u003c\/li\u003e \u003cli\u003eEffect of minor alloying additions \u003c\/li\u003e \u003cli\u003eComposite approaches including nanoscale reinforcements \u003c\/li\u003e \u003cli\u003eMechanical issues affecting reliability \u003c\/li\u003e \u003cli\u003eReliability under impact loading \u003c\/li\u003e \u003cli\u003eThermomechanical fatigue \u003c\/li\u003e \u003cli\u003eChemical issues affecting reliability \u003c\/li\u003e \u003cli\u003eWhisker growth \u003c\/li\u003e \u003cli\u003eElectromigration \u003c\/li\u003e \u003cli\u003eThermomigration \u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003ePresenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.\u003c\/p\u003e\n\u003c\/div\u003e\u003cdiv\u003e \u003cb\u003eK. N. Subramanian\u003c\/b\u003e is Professor of Materials Science and Engineering at Michigan State University. He has been a full-time faculty member at MSU for over 45 years. For the last 15 years he has devoted all his research efforts to lead-free electronic solders.\u003c\/div\u003e\u003cbr\u003e\u003ctable\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublication Date: \u003c\/td\u003e\n\u003ctd\u003e09 April 2012\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublisher: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eImprint: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eISBN-13: \u003c\/td\u003e\n\u003ctd\u003e9780470971826\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFormat: \u003c\/td\u003e\n\u003ctd\u003eHardback\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePage Count: \u003c\/td\u003e\n\u003ctd\u003e520\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight (oz): \u003c\/td\u003e\n\u003ctd\u003e32.0\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/table\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":44380565340300,"sku":"9780470971826","price":180.86,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9780470971826_b856892a-09f9-4542-be2c-abf4dadd6b54.jpg?v=1780104213","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9780470971826","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}