{"product_id":"9780412084515","title":"Microelectronics Packaging Handbook: Subsystem Packaging Part III","description":"\u003ch1\u003eMicroelectronics Packaging Handbook: Subsystem Packaging Part III\u003c\/h1\u003e \u003ch2\u003eTummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.\u003c\/h2\u003e \u003cp\u003eThis thoroughly revised and updated three volume set continues  to be the standard reference in the field, providing the latest in  microelectronics design methods, modeling tools, simulation  techniques, and manufacturing procedures. Unlike reference books that  focus only on a few aspects of microelectronics packaging, these  outstanding volumes discuss state-of-the-art packages that meet the  power, cooling, protection, and interconnection requirements of  increasingly dense and fast microcircuitry. Providing an excellent  balance of theory and practical applications, this dynamic compilation  features step-by-step examples and vital technical data, simplifying  each phase of package design and production. In addition, the volumes  contain over 2000 references, 900 figures, and 250 tables. \u003cbr\u003e  \u003cem\u003ePart I: Technology Drivers\u003c\/em\u003e covers the driving force of  microelectronics packaging - electrical, thermal, and  reliability. It introduces the technology developer to aspects of  manufacturing that must be considered during product development.  \u003cbr\u003e  \u003cem\u003ePart II: Semiconductor Packaging\u003c\/em\u003e discusses the interconnection  of the IC chip to the first level of packaging and all first level  packages. Electrical test, sealing, and encapsulation technologies are  also covered in detail. \u003cbr\u003e  \u003cem\u003ePart III: Subsystem Packaging\u003c\/em\u003e explores board level packaging as  well as connectors, cables, and optical packaging.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 1997-01-31\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9780412084515\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-1-4615-6041-8\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 628\u003c\/p\u003e ","brand":"Springer US","offers":[{"title":"Default Title","offer_id":47185258807436,"sku":"9780412084515","price":152.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9780412084515.jpg?v=1775013034","url":"https:\/\/fh90cf-fv.myshopify.com\/products\/9780412084515","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}